| Title: | Diffusion Protection of Thermoelectric Cooler Junctions as a Means of Increasing Their Reliability | |
| Autors: | V. Semenyuk, A. Antonenko | |
| Published: | Proceedings of the 5-th European Conference on Thermoelectrics, Odessa, Ukraine, 2007, pp. 90-93 | |
| Abstract: | The problem of anti-diffusion protection of a TEC junctions is under consideration. The experimental data on the influence of a protective nickel layer thickness on the long-term stability of TEC parameters at elevated temperatures are given. It is shown that the improvement of a TEC junctions is the basic means to increase its reliability and mechanical strength. The dependence of a junction mechanical properties on Ni layer thickness is investigated. The results obtained are used for creating novel TECs compatible with elements of semiconductor optoelectronics on factor of reliability. | |
| Title: | Thermoelectric Cooling With Constrained Heat Removal | |
| Autors: | V. Semenyuk, R. Dekhtyaruk | |
| Published: | Proceedings of the 5-th European Conference on Thermoelectrics, Odessa, Ukraine, 2007, pp. 94-97 | |
| Abstract: | A generalized approach to the problem of thermoelectric cooling in the conditions of constrained heat removal is given and the utmost combination of initial restrictions which exhausts a TEC abilities to provide specified thermal conditions is defined. The thermoelectric system for cooling PC processor with power dissipation of 67 W was developed and tested. It was shown that the use of the TEC can lead to considerable lowering the cooled object temperature as compared with that for the case of passive heat rejection. To acheave this effect, the optimal co-ordination of all system elements have to be made icluding cooled object, thermoelectric cooler, heat exchanger and a fan. | |
| Title: | Miniature Thermoelectric Modules with Increased Cooling Power | |
| Autors: | V. Semenyuk | |
| Published: | Proceedings of the 25-th International Conference on Thermoelectrics, Vienn, Austria, 2007, pp. 322-326 | |
| Abstract: | The tecnique for producing TEcs with TE pellets as short as 130 microns is demonstrated and test results are given and descussed. It is shown that in the range of operational ΔT from 25 to 70K these TECs exceed all competing film-type devices on cooling power density and have advantage of considerably higher COP. | |
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